Steady-state thermal conductivity measurements of AlN and SiC substrate materials - Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
نویسنده
چکیده
Abstmct-Measurements of thermal conductivity on conventional and newly developed electronic ceramics are presented as part of an effort to incorporate the new high thermal conductivity ceramics into microcircuit manufacturing. Motivated by large variations in values claimed by different vendors for ostensibly similar materials, a longitudinal bar apparatus was built to measure thermal conductivities of actual s u b strate materials on both an individual and a lot sampling basis. The longitudinal bar method is compared to other experimental techniques for measuring thermal conductivity.
منابع مشابه
Precision Measurement and Mapping of Die-Attach Thermal Resistance - Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on [see also Compon
The thermal resistance of the attachment between a die and its carrier contributes strongly to the total temperature rise in an electronic system. The die attach resistance often differs substantially from the value predicted using the bulk thermal conductivity of the attachment material because of partial voiding and delamination. These defects can be introduced during the attachment process o...
متن کاملThermal characteristic evaluation system to evaluate heat transfer characteristics of mounted materials
he increasing amount of heat generated by electronic devices is making devices thermal design and ways to combat heat more and more important issues to deal with. Therefore, we have developed a system able to evaluate thermally conductive materials such as conductive adhesives. The measurement technology is based on the steady-state method, and can evaluate heat transfer characteristics of moun...
متن کاملThermal and electrical conductivity of Aluminium Nitride nanofluids
This study was designed to experimentally measure the thermal and electrical conductivities of Aluminium Nitride/Ethylene Glycol (AlN/EG) nanofluids. Transmission electron microscopy (TEM) was used to characterize the shape of AlN nanoparticles. Nanofluids with different particle volume concentrations of 0.5%, 1%, 2%, 3%, 4%, and 5% were utilized. The thermal and electrical conductivities of the...
متن کاملThermal Conductivity and Contact Resistance Measurements for Adhesives
Thermal adhesives that contain large concentrations of high thermal conductivity filler materials, such as ceramics or metals, are widely used by the electronics industries in a variety of applications. The thermal properties of these materials, such as the thermal contact resistance across a bonded joint and the thermal conductivity of the bulk material, are critical to the selection of the “b...
متن کاملAn experimental assessment of nanostructured materials embedded in a PCM-based heat sink for transient thermal management of electronic
In the present paper, an experimental assessment was performed on the transient thermal performance of a heat sink filled by a phase change material (PCM) and PCM embedded with carbon nanofibers (CNFs) and titania (TiO2) nanoparticles as nanostructured materials. In order to enhance the thermal conductivity of PCM, CNFs and TiO2 nanoparticles at different loadings (0.5wt. % and 2 wt.% of CNFs a...
متن کامل